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Card Bus Socket Connectors
IC9 Series sFeatures
1. Compliant with PC Card Standards
Complies with latest requirements of PC Card Standard.
2. Repairable
Repairable terminations of connector solder joints after installation on the board.
3. Lead Offset
Available with two board mounting levels of terminations, to allow use of different height components.
sProduct Specifications
Ratings Current rating 0.5 A Operating temperature -55c to +85c (Note 1) Storage temperature -10c to +60c (Note 2) 40 to 70% (Note 2) Voltage rating 125 V AC Operating humidity 95% R.H. or less (No condensation) Storage humidity
Item 1. Insulation resistance 2. Withstanding voltage 3. Contact resistance 4. Vibration
Specification 1000M ohms min. No flashover or insulation breakdown. 40 m ohms max. (initial value) No electrical discontinuity of 100ns or more 500 V DC 500 V AC / 1 minute 1 mA
Conditions
Frequency: 10 to 2000 Hz, single amplitude of 0.75 mm or acceleration of 147 m/s2(peak), 4 hours in each of the 3 directions. 96 hours at temperature of 40c and humidity of 90% to 95% -55c, 30 min/15 to 30c, within 5 min/85c30 min /15 to 35c, within 5 min, for 5 cycles 10000 cycles at 400 to 600 cycles per hour Reflow: At the recommended temperature profile Manual soldering: 300c for 3 seconds
5. Humidity (Steady state) Insulation resistance: 100 M ohms min. 6. Temperature cycle 7. Durability (Insertion/withdrawal) 8. Resistance to soldering heat No damage, cracks, or parts looseness. Change of contact resistance from the start should be 20 m ohms max. No deformation of components affecting performance.
Note 1: Includes temperature rise caused by current flow. Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation.
sMaterials
Part Insulator Contact Ground plate Material PA Phosphor bronze Brass Lead Area Lead Area Finish Black Contact Area : gold plating : solder plating : solder plating Contact Area : gold plating Notes UL94V-0 ---------------------------------
A48
sOrdering Information
IC9 - 68 R D - 0.635 SFA
1 1 2 3 4 5 6 2 3 4 5 6 Series name : IC9 Number of contacts : 68 R : card connector D : 2-row alignment Lead pitch : 0.635 mm Offset type SF : 0.3 mm offset SFA : 0.9 mm offset
BLead Offset
qType with 0.3 mm offset qType with 0.9 mm offset
BMounting Method
1. Place and solder the connector without the ground plate as shown in fig.(a). 2. Place the ground plate over the connector as shown in Fig.(b), making sure that the locking tabs are correctly aligned with the slots on both sides of the insulator. Press firmly at both ends to assure secure lock. Note: Care should be taken that the termination leads of the ground plate are not deformed or damaged during this operation. 3. Solder the termination leads of the ground plate to the board.
A49
sCard Connectors
Part Number IC9-68RD-0.635SF IC9-68RD-0.635SFA
CL No. 640-0901-2 640-0902-5
A 0.3 0.9
Socket Connector
Ground Plate
Combined Condition
A50
BPCB mounting pattern
BTemperature Profile
5 s.max 250 240c
200 Temperature(c)
200c
Applicable Conditions Reflow system : IR reflow Solder
: Paste type 63 Sn/37 Pb
150
160c 150c
(Flux content 9 wt%) Test board Glass epoxy 60mm x 60mm x 1.6 mm Metal mask thickness: 0.15 mm Recommended temperature profile.
(20 to 30s) Soldering 120
100
50 25c 0 start 60 (60s) (60 to 90s) Preheating
(30s)
The temperature may be slightly changed according to the solder paste type and amount.
Time(seconds)
A51

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